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Silicone Potting Compound INI-9325
Two-component silicone, platinum-curing, flowable, vulcanizes at room temperature.
Can be used for a long time in the temperature range of - 65 ° C - 200 ° C and keep its soft and elastic properties.
Application:
Used for potting, encapsulating, sealing and bonding, widely used in electronic products, electricity, power supply, automotive etc. For example, used for potting of electronic components, power module and control module and controllers, junction box, solar cell assembly etc.
Can reduce stress and withstand high and low temperature impact. For the high power control module, thermal conductive silicone is used to achieve the function of heat dissipation, or outdoor protection for electronics such as LED screen. Improve the insulation level of electronics, improve heat dissipation, and avoid the risk of electronics overheating and burning in a short time.
| Category | Properties Index | Test Report |
|---|---|---|
| Before Curing | Appearance | Transparent fluid |
| Viscosity(cps) | 550±100 | |
| Operating | Mixing Ratio (By weight) | 1:1 |
| Operating Time (25ºC) | 20~30 min (Adjustable) | |
| Curing time (Basically cured) | 1~2 hr (Adjustable) | |
| Curing time (Perfectly cured) | 12 hr | |
| After Curing | Hardness (Shore A) | 25±3 |
| Thermal conductivity [W(m·K)] | ≥0.2 | |
| Dielectric strength (kV/mm) | ≥25 | |
| Volume resistivity (Ω·cm) | ≥1.0×10¹⁶ | |
| Fire resistance | UL94-V0 | |
| Density (g/cm³) | 1.08 |
* Notes: Above data are reference values only.
1. Mixing: Mix part A and part B evenly with the specified mixing ratio. Weigh exactly using electronic scales.
2. Vacuum Pumping: (Optional but recommended) To ensure no bubbles in the finished mold. This step should be under 10 minutes.
3. Pouring or Brushing: Use pouring for simple patterns (low viscosity required) or brushing for delicate patterns (high viscosity required).
Package Details: 1kg / 5kg / 20kg / 25kg / 200kg
